HY P15 Thermal Grease CPU Chipset Cooling Compound Silicone Plaster Heat Sink Compound 15.2-W/m-k 1G/2G thermal grease compound remover thermal grease electronics
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THERMAL CONDUCTIVITY – 15.2W/m-K
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SPECIFICATION GRAVITY – 2.5g/ML
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TEMPERATURE RANGE – -20-130 Degree c
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VISCOSITY – 130Pa S
Features:
brand new and
Apply to CPU, VGA, Chipset, Radiator and other PC components.
Thermal grease helps your electrical appliance to thermal conductivity and heat dissipation.
Helps disperse the heat from CPU to heatsink effectively.
To ensure that the electronic instruments meters- and other electrical performans stability.
High temperature resistant tasteless, non-corrosive.Low thermal resistant and high conductivity for superior heat transfer.
Specifications:
Model: HY P15
Color: Gray
Capacity: 1G
Thermal conductivity:approx 15.2-W/m-k
Concentration: 280±10 1/10mm
Instantaneous temperature resistance: -30-180℃
Working temperature: -20-150℃
